Product
NEMST-Jet2008I series
Back-Side Polymer Removal Plasma
- Arc Jet Plasma design.
- Integrated with Equipment Front End Module. (EFEM)
- Vacuum Rotating Stage design to fix the wafer.
- Excellent cleaning effect with concentrated plasma energy.
- Fast treatment speed.
- Gap between nozzle and wafer can be larger.
- Indirect/Remote plasma design.
- Reaction gas: CDA and etc.
- Low reaction gas consumption and running cost.
- Effective Range: Φ 10 mm or smaller.
- Treatment Speed: 50 mm/sec~300 mm/sec.
- Gap between nozzle and substrate: 5 mm ~ 15 mm.
- Plasma On Stabilizing Time: < 0.5 sec.
- High plasma stability.
- Indirect/Remote Plasma with no ESD.
- Can be suitable for different kinds of materials with various shapes.
- Backside Polymer Removal: Specialized plasma solution for removing polymer residue from the wafer backside in post-semiconductor processes.
- High-Yield Processing: Ensures a residue-free surface on the wafer backside to optimize subsequent packaging yield.